Product Overview
Vertical Ground Bar Kits, 0.625x72.00, Electroplated, Copper
- Components specially designed to efficiently facilitate reliable connections
- Enable system to meet equipment manufacturer grounding requirements
- Components fit EIA 310-D-rated open frame racks
PRODUCT ATTRIBUTES
- Material: Copper
- Bar Size: 72.00 x .625 x .25 in / 1829 x 16 x 6 mm
- Color: Unpainted
- Finish: Electroplated
- Thickness: 0.25 in / 6 mm
- Weight: 4.2 lb
DRAWINGS AND DOCUMENT DOWNLOADS
2D DXF
3D Step
Approval Agency Certificate
Engineering Specification
Installation Manual / Instruction Sheet
ADDITIONAL PRODUCT DETAILS
The Vertical Ground Bar Kit mounts vertically on a rack, providing a convenient place to connect equipment grounds. It is made of electrolytic tough-pitch 110 copper alloy. The kit includes a ground bar with a compression lug for #2 wire, connection hardware, and mounting hardware.
These components meet open frame rack and cabinet bonding and grounding requirements for telecommunication room and data center applications.
BULLETIN NUMBER
Other Information
Vertical Ground Bar Kits, 0.625x72.00, Electroplated, Copper
- Components specially designed to efficiently facilitate reliable connections
- Enable system to meet equipment manufacturer grounding requirements
- Components fit EIA 310-D-rated open frame racks
PRODUCT ATTRIBUTES
- Material: Copper
- Bar Size: 72.00 x .625 x .25 in / 1829 x 16 x 6 mm
- Color: Unpainted
- Finish: Electroplated
- Thickness: 0.25 in / 6 mm
- Weight: 4.2 lb
DRAWINGS AND DOCUMENT DOWNLOADS
2D DXF
3D Step
Approval Agency Certificate
Engineering Specification
Installation Manual / Instruction Sheet
ADDITIONAL PRODUCT DETAILS
The Vertical Ground Bar Kit mounts vertically on a rack, providing a convenient place to connect equipment grounds. It is made of electrolytic tough-pitch 110 copper alloy. The kit includes a ground bar with a compression lug for #2 wire, connection hardware, and mounting hardware.
These components meet open frame rack and cabinet bonding and grounding requirements for telecommunication room and data center applications.
