Product Overview
DESCRIPTION
The Mini-Com® High Density Angled Modular Patch Panel accepts up to 48 Mini-Com Modules for unshielded applications in 1 RU and mounts to 19 inch and 23 inch racks and cabinets. The panel can be identified with adhesive labels and is black.
DESCRIPTION
The Mini-Com® High Density Angled Modular Patch Panel accepts up to 48 Mini-Com Modules for unshielded applications in 1 RU and mounts to 19 inch and 23 inch racks and cabinets. The panel can be identified with adhesive labels and is black.
